Taiwan-based Altek recently announced that it will showcase its newest 3D sensing IC dubbed AL6100 at CES (Consumer Electronics Trade Show) in Las Vegas this year to show its technology capabilities and explore business opportunities associating with 3D sensing and AI, the Economics Daily News reported on January 4. Altek said that the company's first generation of 3D sensing IC dubbed AL3200 in 2016 has been able to deliver real-time depth images at 30fps and have accumulative volume of over 10 million units shipped to its Chinese clients. The new 3D sensing IC has combined the infrared control and has been able to boost its image depth quality and computing speed. It is expected to apply to a variety of products that require real-time computing such as smartphones, security control devices, autonomous vehicles, smart home assistants, drones, and cleaning robots. The company will begin shipments for its AL6100 3D sensing ICs in the first quarter of 2018.